Esec


About Esec

Awards

Winner of the Swiss Technology Award 2008

06 Nov 2008

Esec’s new epoxy Die Bonder 2100 xP was honored on November 6, 2008, with the prestigious Swiss Technology Award for being the most innovative Swiss product.

07 Oct 2008
Spansion Spotlight Award 2007
Award for "Exceptional Support"
09 Mar 2008
Best Supplier Award 2007
Best Supplier Award 2007 from ST Microelectronics, Shenzhen
18 Feb 2008
Top Supplier Award Asia Pacific 2006/2007
"Top Supplier Award Asia Pacific" and "Best Supplier Partnership" 2006/2007 from Infineon
20 Jun 2007
Oerlikon Esec receives prestigious 2006 Spotlight Award from Spansion
Oerlikon Esec is very proud to have received the prestigious “Spansion Spotlight Award 2006” that honors outstanding progress in the support to Spansion.
15 May 2007
Oerlikon Esec honored by Infineon
Oerlikon Esec receives "Infineon Best Supplier Award Asia Pacific FY 05/06"
26 Mar 2007
Oerlikon Esec rated as #1 Equipment Supplier in China
Oerlikon Esec has been named at the VLSI Customer Satisfaction Survey in China as #1 in the Assembly&Packaging Equipment Market and as #3 of the entire Semiconductor Equipment Market
15 Jan 2007
Best Service Support 2006
Best Service Support 2006 from ST Microelectronics, Shenzhen
06 Apr 2005
Supplier Appreciation Award 2005
Supplier Appreciation Award 2005 from Texas Instruments
06 Jan 2005
Outstanding Supplier Award 2005
Outstanding Supplier Award 2005 from ANST (China Resource)
06 Jan 2005
Best Service Support 2005
Best Service Support 2005 from STS
06 Jan 2005
Best Supplier Award 2004/2005
Best Supplier Award 2004/2005 from Infineon Technologies Malaysia
05 May 2004
10 Best Chip Making Equipment Supplier 2004
10 Best Chip Making Equipment Supplier 2004 from VLSI Research
05 Mar 2004
Best Supplier Award 2003/2004
Best Supplier Award 2003/2004 from Infineon Technologies Malaysia
04 Mar 2002
Best Supplier Award 2001/2002
Best Supplier Award 2001/2002 from Infineon Technologies Malaysia
01 Jan 2002
2002 Award for Excellence in Electronics Packaging and Production
ESEC (USA) Inc., a finalist in the electronics assembly chemicals and materials category, has received an Award from EP&P for Lead-free Soft Solder for the Die Attach Process.

  • Print page